High-Density Brass SMT Stencil Foil (0.12mm / 120µm)
Chemically etched and laser micro-apertured brass stencil for clean solder paste dispensing on 0402 passives and fine-pitch QFN/BGA ICs.
Payment is retained in secure escrow until delivered and verified. Zero risk of defective parts or lost shipments.
Technical Specifications & Dimensional Tolerances
Fabrication & Material Parameters
- Material Alloy
- Half-Hard Spring Brass (BRASS)
- Guaranteed Tolerance
- ±0.008 mm
- Dimensions (L × W × H)
- 150 × 150 × 0.12 mm
- Approx. Unit Weight
- 60 g
Quality & Compliance Standards
- Thickness
- 120 microns (0.12 mm)
- Min Aperture Pitch
- 0.4 mm BGA Capable
Frequently Asked Questions
Customer Ratings & Reviews
VerifiedAudited feedback from verified manufacturing customers with confirmed order delivery.
Based on 18 verified purchases
Dimensionally spot on. We checked the bore on our coordinate measuring machine (CMM) and it held within 0.012 mm of the CAD nominal. Anodizing finish is uniform and clean. Will order production batches.
Thank you Vikram! All our mounts are 4-axis billet milled with single-setup zero re-fixturing to guarantee concentricity.
Fast 48-hour delivery to Bengaluru. Packaged with heavy anti-corrosion VCI paper and certificate of dimensional conformance. Great value for high-strength aluminum.
Rigid and clean chamfering. Thread tapping was precise without any burs. Very satisfied with the turnaround time.
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